
Delock thermal pad 120 x 20 x 3 mm for M.2 modules 3.0 WmK
3 mm, 3 W/m K
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The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. With a thermal conductivity of 3.0 W/mK, it optimizes thermal efficiency and helps improve performance as well as extend the lifespan of electronic components. The pad is designed for a wide temperature range of -60 °C to 180 °C, making it versatile for various applications. Its compact dimensions of 120 x 20 x 3 mm allow for easy integration into different setups. The product comes in a resealable bag, providing convenient storage.
- Thermal conductivity of 3.0 W/mK for efficient heat dissipation
- Operating temperature range of -60 °C to 180 °C
- Optimizes performance and lifespan of M.2 modules
- Compact dimensions for easy integration into various applications.

Delock thermal pad 120 x 20 x 3 mm for M.2 modules 3.0 WmK
3 mm, 3 W/m K
The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. It is designed to optimize the performance of electronic components and extend their lifespan. With a thermal conductivity of 3.0 W/mK, the pad ensures efficient heat transfer, which is crucial for the stability and reliability of high-performance applications. The pad can be used in a wide temperature range from -60 °C to 180 °C, making it versatile and adaptable to various environments. Its compact dimensions of 70 x 20 x 1.75 mm allow for easy integration into different devices and systems. This product is a valuable addition for anyone needing reliable heat dissipation in their electronic applications.
- Thermal conductivity of 3.0 W/mK for optimal heat transfer
- Operating temperature range of -60 °C to 180 °C
- Compact dimensions for easy integration into M.2 modules.

Delock Wärmeleitpad 70 x 20 x 1,75 mm für M.2 Module 3,0 W/m
1.75 mm, 3 W/m K
This thermal pad from Delock is designed for heat dissipation, for example on an M.2 module. The goal of the pad is to improve performance and extend the lifespan of the components.
Low oil bleed: This pad has a particularly low oil bleed, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with "Low Oil Bleeding" maintain their thermal and mechanical properties better, ensuring consistent and stable heat dissipation.
Technical specifications:
- Thermal pad for heat dissipation
- Low oil bleed
- Thermal conductivity: 3.2 W/mK
- Operating temperature: -60 °C to 180 °C
- Color: gray
- Dimensions (LxWxH): approx. 120 x 20 x 0.5 mm
Package contents:
1 x thermal pad.

Delock Wärmeleitpad 120 x 20 x 0,5 mm für M.2 Module 3,2 W/m
The Delock M.2 Key E Plug to M.2 Key E Slot Adapter is a practical solution for protecting the M.2 interface and facilitating the use of M.2 modules. This adapter acts as a port protector, safeguarding the interface from wear and tear during frequent plugging and unplugging. It also allows for easy extension and secure testing of M.2 modules, making it ideal for laboratory use. The adapter is compatible with various M.2 formats, including 2242 and 2230, and supports modules with a maximum component height of 1.5 mm, including double-sided modules. The package includes the adapter, a thermal pad, mounting materials, and rubber rings to ensure optimal use.
- Port protector for M.2 interface
- Easy extension of M.2 modules
- Compatible with various M.2 formats
- Includes thermal pad for optimal cooling.

The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. It is designed to optimize the performance of electronic components and extend their lifespan. With a thermal conductivity of 3.0 W/mK, this pad ensures efficient heat transfer, which is crucial for the stability and reliability of high-performance applications. The pad is suitable for a wide temperature range of -60 °C to 180 °C, making it versatile for various uses. Its compact dimensions of 120 x 20 x 2 mm allow for easy integration into different systems. This product is an ideal choice for anyone needing reliable heat dissipation for their M.2 modules.
- Thermal conductivity of 3.0 W/mK for optimal heat dissipation
- Operating temperature range of -60 °C to 180 °C
- Enhances the performance and lifespan of components.

Delock Wärmeleitpad 120 x 20 x 2 mm für M.2 Module 3,0 W/mK
2 mm, 3 W/m K
The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. With a thermal conductivity of 3.0 W/mK, it ensures optimal temperature regulation of the components, improving both the performance and lifespan of the hardware. The pad is suitable for a wide temperature range of -60 °C to 180 °C, making it a versatile choice for various applications. Its compact dimensions of 70 x 20 x 0.75 mm allow for easy integration into tight spaces. The product comes in a resealable bag, providing convenient storage.
- Thermal conductivity of 3.0 W/mK for efficient heat dissipation
- Operating temperature range of -60 °C to 180 °C
- Ideal for use with M.2 modules
- Compact dimensions for easy integration into various applications.

Delock thermal pad 70 x 20 x 0.75 mm for M.2 modules 3.0 WmK
0.75 mm, 3 W/m K
Delock Thermal Pad Set (2 pieces) 70 x 20 mm for M.2 modules
These self-adhesive thermal pads from Delock are designed for heat dissipation of the M.2 module. They can be applied, for example, between an M.2 SSD and a heatsink.
Thermal pads for heat dissipation
Color: gray
Dimensions (LxWxH): 1) 70 x 20 x 1.75 mm, 2) 70 x 20 x 0.75 mm
System requirements: M.2 module
Package contents: 2 x thermal pad.

This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The purpose of the pad is to improve performance and increase the lifespan of the components.
Low Oil Emission
This pad emits particularly low amounts of oil, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with low oil emission maintain their thermal and mechanical properties better, ensuring consistent and stable heat dissipation.
Technical Data
- Thermal pad for heat dissipation
- Low oil emission
- Thermal conductivity: 3.2 W/mK
- Operating temperature: -60 °C to 180 °C
- Color: gray
- Dimensions (LxWxH): approx. 100 x 100 x 1 mm
Package Contents
1 x thermal pad.

Delock Wärmeleitpad 100 x 100 x 1 mm für M.2 Module 3,2 W/mK
1 mm, 3.20 W/m K
This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The purpose of the pad is to enhance performance and extend the lifespan of components. Typical applications for silicone-free pads can be found in industry as well as in optoelectronics.
Silicone-free
Silicone-free pads do not release oils that could contaminate or damage sensitive components. Therefore, they are ideal for delicate electronics, such as sensors. Additionally, silicone-free pads can be used over a wider temperature range without compromising their properties, which is particularly useful in industrial applications with extreme temperatures. Besides the advantage of longer durability, they are also more environmentally friendly than conventional thermal pads.
Technical specifications
- Thermal pad for heat dissipation
- Thermal conductivity: 3.0 W/mK
- Operating temperature: -60 °C to 180 °C
- Color: pink
- Dimensions (LxWxH): approx. 120 x 20 x 0.5 mm
Package contents
1 x thermal pad.

Delock Wärmeleitpad 120 x 20 x 0,5 mm für M.2 Module 3,0 W/m
0.50 mm, 3 W/m K
This thermal pad by Delock is suitable for heat dissipation, for example on an M.2 module. The aim of the pad is to improve performance and increase the service life of the components.
Technical data
- Thermal conductive pad for heat dissipation
- Thermal conductivity: 3.0 W/mK
- Operating temperature: -60 °C to 180 °C
- Colour: grey
- Dimensions (LxWxH): approximately 120 x 20 x 1.5 mm
Package contents
1 x thermal conductive pad.

Delock Wärmeleitpad 120 x 20 x 1,5 mm für M.2 Module 3,0 W/m
1.50 mm, 3 W/m K