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Delock Wärmeleitpad 70 x 20 x 1,75 mm für M.2 Module 3,0 W/m
1.75 mm, 3 W/m KDelivered Tue, 12.5.
More than 10 pieces in stock
More than 10 pieces in stock
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Product details
The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. It is designed to optimize the performance of electronic components and extend their lifespan. With a thermal conductivity of 3.0 W/mK, the pad ensures efficient heat transfer, which is crucial for the stability and reliability of high-performance applications. The pad can be used in a wide temperature range from -60 °C to 180 °C, making it versatile and adaptable to various environments. Its compact dimensions of 70 x 20 x 1.75 mm allow for easy integration into different devices and systems. This product is a valuable addition for anyone needing reliable heat dissipation in their electronic applications.
- Thermal conductivity of 3.0 W/mK for optimal heat transfer
- Operating temperature range of -60 °C to 180 °C
- Compact dimensions for easy integration into M.2 modules.
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Length | 70 mm |
Width | 20 mm |
Thickness | 1.75 mm |
Item number | 57938469 |
Manufacturer | Delock |
Category | Thermal pads |
Manufacturer No. | 18474 |
Release date | 22.4.2025 |
Colour | Grey |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 3 W/m K |
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Items per sales unit | 1x |
Country of origin | China, Taiwan |
CO₂ emissions | 0.6 kg |
Climate contribution | CHF 0.11 |
Length | 70 mm |
Width | 20 mm |
Thickness | 1.75 mm |
Weight | 9 g |
Length | 13.10 cm |
Width | 7.70 cm |
Height | 0.40 cm |
Weight | 10 g |
Specifications may include unverified machine translations.
30-day right of return
24 Months Warranty (Bring-in)
3 additional offers