Delock Wärmeleitpad 120 x 20 x 0,5 mm für M.2 Module 3,0 W/m
0.50 mm, 3 W/m KMore than 10 pieces in stock at supplier
Product details
This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The purpose of the pad is to enhance performance and extend the lifespan of components. Typical applications for silicone-free pads can be found in industry as well as in optoelectronics.
Silicone-free
Silicone-free pads do not release oils that could contaminate or damage sensitive components. Therefore, they are ideal for delicate electronics, such as sensors. Additionally, silicone-free pads can be used over a wider temperature range without compromising their properties, which is particularly useful in industrial applications with extreme temperatures. Besides the advantage of longer durability, they are also more environmentally friendly than conventional thermal pads.
Technical specifications
- Thermal pad for heat dissipation
- Thermal conductivity: 3.0 W/mK
- Operating temperature: -60 °C to 180 °C
- Color: pink
- Dimensions (LxWxH): approx. 120 x 20 x 0.5 mm
Package contents
1 x thermal pad.
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Length | 120 mm |
Width | 20 mm |
Thickness | 0.50 mm |
Item number | 57938472 |
Manufacturer | Delock |
Category | Thermal pads |
Manufacturer no. | 18481 |
Release date | 22.4.2025 |
Colour | Pink |
Material | Silicone-free |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 3 W/m K |
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Items per sales unit | 1x |
Country of origin | China, Taiwan |
CO₂ emissions | 1.52 kg |
Climate contribution | CHF 0.11 |
Length | 120 mm |
Width | 20 mm |
Thickness | 0.50 mm |
Weight | 23 g |