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Delock thermal pad 70 x 20 x 0.75 mm for M.2 modules 3.0 WmK
0.75 mm, 3 W/m KDelivered between Wed, 25.3. and Wed, 1.4.
More than 10 pieces in stock at supplier
More than 10 pieces in stock at supplier
Free shipping starting at 50.–
Product details
The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. With a thermal conductivity of 3.0 W/mK, it ensures optimal temperature regulation of the components, improving both the performance and lifespan of the hardware. The pad is suitable for a wide temperature range of -60 °C to 180 °C, making it a versatile choice for various applications. Its compact dimensions of 70 x 20 x 0.75 mm allow for easy integration into tight spaces. The product comes in a resealable bag, providing convenient storage.
- Thermal conductivity of 3.0 W/mK for efficient heat dissipation
- Operating temperature range of -60 °C to 180 °C
- Ideal for use with M.2 modules
- Compact dimensions for easy integration into various applications.
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Length | 70 mm |
Width | 20 mm |
Thickness | 0.75 mm |
Item number | 57834151 |
Manufacturer | Delock |
Category | Thermal pads |
Manufacturer no. | 18473 |
Release date | 16.4.2025 |
Colour | Grey |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 3 W/m K |
Max. temperature | 180 °C |
Density | 3 g/cm³ |
Items per sales unit | 1x |
Country of origin | China, Taiwan |
CO₂ emissions | 0.33 kg |
Climate contribution | CHF 0.11 |
Length | 70 mm |
Width | 20 mm |
Thickness | 0.75 mm |
Weight | 5 g |
Length | 13.50 cm |
Width | 8.20 cm |
Height | 0.10 cm |
Weight | 6 g |
Specifications may include unverified machine translations.
30-day right of return
24 Months Warranty (Bring-in)
1 additional offer