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Delock thermal pad 120 x 20 x 3 mm for M.2 modules 3.0 WmK

3 mm, 3 W/m K
Save CHF1.40
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Delivered Tue, 12.5.
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Product details

The Delock thermal pad is an effective solution for heat dissipation, especially for M.2 modules. With a thermal conductivity of 3.0 W/mK, it optimizes thermal efficiency and helps improve performance as well as extend the lifespan of electronic components. The pad is designed for a wide temperature range of -60 °C to 180 °C, making it versatile for various applications. Its compact dimensions of 120 x 20 x 3 mm allow for easy integration into different setups. The product comes in a resealable bag, providing convenient storage.

  • Thermal conductivity of 3.0 W/mK for efficient heat dissipation
  • Operating temperature range of -60 °C to 180 °C
  • Optimizes performance and lifespan of M.2 modules
  • Compact dimensions for easy integration into various applications.

Key specifications

Max. temperature
180 °C
Density
3 g/cm³
Length
120 mm
Width
20 mm
Thickness
3 mm

General information

Item number
57834155
Manufacturer
Delock
Category
Thermal pads
Manufacturer No.
18478
Release date
16.4.2025
Sales rank in Category Thermal pads
18 of 205

Colour

Colour
Grey

Thermal grease properties

Thermal paste type
Heat conducting pad
Thermal conductivity
3 W/m K
Max. temperature
180 °C
Density
3 g/cm³

Scope of delivery

Items per sales unit
1x

Origin

Country of origin
China, Taiwan

Voluntary climate contribution

CO₂ emissions
1.52 kg
Climate contribution
CHF 0.11

Product dimensions

Length
120 mm
Width
20 mm
Thickness
3 mm
Weight
23 g

Package dimensions

Length
16.20 cm
Width
10.40 cm
Height
0.50 cm
Weight
20 g

30-day right of return
24 Months Warranty (Bring-in)
3 additional offers

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