RS PRO Gap filler,mid performance,2.0mm,3.2W/mK

The thermal pad from Rs Pro is a high-performance solution for efficient heat transfer in various applications. With a thickness of 2 mm and a thermal conductivity of 3.2 W/mK, this pad provides an effective way to dissipate heat from electronic components, thereby optimizing their performance and lifespan. It is suitable for operating temperatures ranging from -40 °C to 200 °C, making it versatile for different uses. The gray silicone coating ensures reliable adhesion and a high dielectric strength of up to 6 kV/mm. The square design, measuring 150 mm x 150 mm, allows for easy handling and adaptation to various applications. The UL 94 V0 classification indicates a high level of flammability safety, which is important for use in safety-critical areas.

• Operating temperature of -40 °C to 200 °C
• Dielectric strength of up to 6 kV/mm
• Thermal resistance of 280 mW/°C
• UL 94 V0 flammability classification
• High elasticity and flexibility due to silicone material.