Rs Pro Gap filler,mid performance,2.0mm,4.0W/mK

The Rs Pro thermal pad is a high-performance solution for efficient heat transfer in various applications. With a thickness of 2 mm and a thermal conductivity of 4 W/mK, this pad provides an effective way to conduct heat from one component to another. It is suitable for operating temperatures ranging from -40 °C to 200 °C, making it versatile. The gray silicone coating not only ensures good adhesion but also offers a high breakdown strength of up to 0.7 kV/mm. The pad has a hardness of 25 Shore A, making it flexible and adaptable to different surfaces. These features make the thermal pad ideal for applications in electronics, where efficient heat dissipation is crucial.

• Maximum operating temperature of 200 °C for high performance
• Breakdown strength of up to 0.7 kV/mm for added safety
• High-quality silicone coating for optimal adhesion and flexibility
• Thermal resistance of 280 mW/°C for efficient heat transfer.