RS PRO Gap filler,mid performance,2.0mm,4.0W/mK

The thermal pad from Rs Pro is a high-performance solution for efficient heat transfer in various applications. With a thickness of 2 mm and a thermal conductivity of 4 W/mK, this pad provides an effective way to conduct heat from one component to another. It is suitable for operating temperatures ranging from -40 °C to 200 °C, making it versatile. The gray silicone coating not only ensures good adhesion but also offers a high dielectric strength of up to 0.7 kV/mm. The pad has a hardness of 25 Shore A, making it flexible and adaptable to conform to different surfaces. These features make the thermal pad ideal for applications in electronics, where efficient heat dissipation is crucial.

• Maximum operating temperature of 200 °C for high performance
• Dielectric strength of up to 0.7 kV/mm for added safety
• High-quality silicone coating for optimal adhesion and flexibility
• Thermal resistance of 280 mW/°C for efficient heat transfer.