Rs Pro Gap filler,mid performance,1.0mm,3.2W/mK

The thermal conductive pad from Rs Pro is a high-performance solution for efficient heat transfer in various applications. With a thickness of 1 mm and a thermal conductivity of 3.2 W/mK, this pad provides an effective way to transfer heat from one component to another. It is particularly suitable for use in high-temperature environments, as it can withstand operating temperatures of up to 200 °C while also being usable in extreme conditions down to -40 °C. The square shape and dimensions of 150 mm x 150 mm make it versatile. The material is made of silicone, which not only ensures good thermal conductivity but also has a high dielectric strength of up to 6 kV/mm. These features make the thermal conductive pad a reliable choice for applications in electronics, mechanical engineering, and the automotive industry.

• Maximum operating temperature of 200 °C and minimum operating temperature of -40 °C
• Dielectric strength of up to 6 kV/mm
• Thermal resistance of 280 mW/°C
• Silicone material with a hardness of 20 Shore A.