The GP-Ultimate is designed to provide perfect thermal contact with heat sinks when installed on circuit boards with height differences and uneven surfaces, such as power MOSFETs, chipsets, analog ICs, microcontroller units, and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition, and ultimate thermal conductivity, the GP-Ultimate optimally fills gaps and delivers the best performance in its class.
The GP-Ultimate is non-electrically conductive, non-corrosive, non-hardening, non-toxic, and supports an extended operating temperature range of -60 °C to 220 °C. It features easy application and has dimensions of thermal pads measuring 90 x 50 mm, making it ideal for large circuit board surfaces of GPU cards, motherboards, expansion cards, and other densely packed electronic devices.
Length | 50 mm |
Width | 90 mm |
Thickness | 2 mm |
Density | 3.20 g/cm³ |
Electrical conductivity | Non-conductive (0 S/m) |
Max. temperature | 220 °C |
Item number | 35748396 |
Manufacturer | Gelid |
Category | Thermal pads |
Manufacturer no. | TP-GP04-D |
Release date | 21.5.2023 |
Sales rank in Category Thermal pads | 31 of 213 |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 15 W/m K |
Max. temperature | 220 °C |
Density | 3.20 g/cm³ |
Electrical conductivity | Non-conductive (0 S/m) |
Items per sales unit | 1 x |
CO₂-Emission | |
Climate contribution |
Length | 50 mm |
Width | 90 mm |
Thickness | 2 mm |
Weight | 39 g |