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Specifications

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General information

Manufacturer Lenovo
Product type Servers
Item number5988312
Manufacturer no.70LX001HEA
Sales rank in Product type Servers14 of 170
External links Manufacturer's site (de)

Hardware form factor

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Hardware form factor

A form factor describes the different sizes and standards of a system or major system components.

Design
Tower

Processor

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Processor

A processor is a key component of a computing device, which steers other components via software. The fundamental property of a processor is its programmability. The behaviour of a processor is determined by programmers by means of computer code. The main processor components are the register, arithmetic and logic unit (ALU), control unit and the memory management unit (MMU), which administers memory. Central tasks of a processor include arithmetic operations, reading and writing data in the memory as well as executing programme jumps.

Processor type
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Processor type

Beschreibt den Typ des Prozessors.

Intel Xeon E3-1225 v5
Number of processors
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Number of processors

Describes how many processors the device has. A central processing unit (CPU), also referred to as a central processor unit, is the hardware within a computer that carries out the instructions of a computer program by performing the basic arithmetical, logical, and input/output operations of the system.

More information...

1 x
Processor clock frequency
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Processor clock frequency

In electronics and especially synchronous digital circuits, a clock signal is a particular type of signal that oscillates between a high and a low state and is utilized like a metronome to coordinate actions of circuits. Although the word signal has a number of other meanings, the term is here used for "transmitted energy that can carry information".

A clock signal is produced by a clock generator. Although more complex arrangements are used, the most common clock signal is in the form of a square wave with a 50% duty cycle, usually with a fixed, constant frequency. Circuits using the clock signal for synchronization may become active at either the rising edge, falling edge, or, in the case of double data rate, both in the rising and in the falling edges of the clock cycle.

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3.30 GHz
Number of threads
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Number of threads

In computer science, a thread of execution is the smallest unit of processing that can be scheduled by an operating system. The implementation of threads and processes differs from one operating system to another, but in most cases, a thread is contained inside a process. Multiple threads can exist within the same process and share resources such as memory, while different processes do not share these resources. In particular, the threads of a process share the latter's instructions (its code) and its context (the values that its variables reference at any given moment). To give an analogy, multiple threads in a process are like multiple cooks reading off the same cook book and following its instructions, not necessarily from the same page.

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4
Number of processor cores
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Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

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4 (Quad core)
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4 (Quad core)

The processor has four cores.

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Number of processors socket
1 x
Max. turbo clock rate
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Max. turbo clock rate

Using the Intel Turbo Boost Technology, the frequency of the processor can be dynamically increased in operation

3.70 GHz
Max. TDP
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Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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80 W
L3 Cache
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L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

More information...

8 MB
Processor family
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Processor family

The family the processor belongs to.

Xeon E3

Motherboard properties

CPU socket
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CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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LGA 1151

Memory

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Memory

Computer data storage, often called storage or memory, is a technology consisting of computer components and recording media used to retain digital data. It is a core function and fundamental component of computers.

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Memory type
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Memory type

DDR-SDRAM („Double Data Rate Synchronous Dynamic Random Access Memory“) ist ein Typ von Random Access Memory (RAM), den es aktuell in drei Kategorien gibt. DDR-SDRAM mit 184 Kontakten, DDR2-SDRAM mit 240 Kontakten und DDR3-SDRAM ebenfalls mit 240 Kontakten. Verwendet werden sie hauptsächlich für Speichermodule des DIMM- bzw. SO-DIMM-Standards als Arbeitsspeicher in PCs und Laptops.

More information...

DDR4-RAM
Memory Slots max
4
Storage capacity 1 (RAM)
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Storage capacity 1 (RAM)

Random access memory (usually known by its acronym, RAM) is a type of computer data storage. Today it takes the form of integrated circuits that allow the stored data to be accessed in any order, i.e. at random.

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8 GB
RAM total
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RAM total

Random access memory (usually known by its acronym, RAM) is a type of computer data storage. Today it takes the form of integrated circuits that allow the stored data to be accessed in any order, i.e. at random.

More information...

8 GB
Max. RAM
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Max. RAM

Working memory is the system that actively holds multiple pieces of transitory information in the mind, where they can be manipulated. This involves execution of verbal and nonverbal tasks—such as reasoning and comprehension—and makes them available for further information-processing.

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64 GB
RAM speed
2133 MHz
RAM error correction
ECC
RAM buffer
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RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

unbuffered

Hard drives

Number of hard disks max
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Number of hard disks max

Maximum number of hard disks

4
Form factor
3.5"

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Warranty & right to return

Dead on arrival (DOA) 6 Days Bring-in

Warranty 24 month Bring-in

Limited right of return

Warranty and return

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Availability

Mail delivery

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Information subject to change.

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Lenovo ThinkServer TS150 (Intel Xeon E3-1225 v5, 8GB, 3.5") Lenovo ThinkServer TS150 (Intel Xeon E3-1225 v5, 8GB, 3.5")