Name: Spartan 5 MAX EY3A003
Brand: Endorfy
SKU: 24472532
Price: 21.5 CHF
Availability: InStock
Rating: 4.03 (36 reviews)

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Endorfy

The Endorfy Spartan 5 MAX is a compact cooler with a height of 14.6 cm and a 120 mm Fluctus fan. Thanks to the densely ribbed heatsink with four heat pipes, you don't have to worry about high temperatures. With this cooler, you can render and design without the concern of overheating. The Endorfy Spartan 5 MAX is also compatible with many sockets, from older ones like AM2 and LGA1156 to AM5 and LGA1700, as well as large RAM modules. The 120 mm Fluctus fan ensures a constant airflow. The fins are designed to channel as much air as possible through the closely arranged heatsink fins. Each fan blade has a wavy edge that further reduces fan noise. At first glance, the Spartan 5 MAX may seem small, but the "MAX" in its name is not without reason. The cooler fits into small cases and keeps temperatures low. Effective cooling is enabled by the heatsink with dense ribs, which dissipates heat well. The optimized base with direct-touch heat pipes significantly improves heat dissipation. The Spartan 5 MAX can be installed in no time, without the need for additional tools. A 120 mm Fluctus fan is already installed, making the entire process easy to manage.

Actual product image Endorfy Spartan 5 MAX EY3A003 (146 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

power connector

Height (with fan)

Spartan 5 MAX EY3A003

CPU coolers

30-day right of return

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Voluntary climate contribution

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With a maximum heat dissipation of 180W TDP, the cooler is suitable for mid-range processors.

Moderate Cooling Performance

With a total height of 14.6 cm, the model can also be installed in smaller cases with limited space.

Compact Height

An included quick-start guide enables fast installation of the cooler on the motherboard within minutes.

Easy Installation

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Endorfy Spartan 5 MAX EY3A003

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Moderate Cooling Performance

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