Name: Fortis 5
Brand: Endorfy
SKU: 23598570
Price: 41 CHF
Availability: InStock
Rating: 4.2 (5 reviews)

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The Fortis 5 Dual Fan is one of those coolers that truly stands out. It keeps the CPU cool, remains quiet, and fits easily into most cases, even smaller ones where finding parts can be more challenging due to height restrictions. This is thanks to two fans: the Fluctus 140 mm and the Fluctus L120, which are mounted on a densely ribbed heatsink. This powerful combination is excellent for push/pull systems that further lower CPU temperatures. The Fortis 5 Dual Fan is compatible with the most common sockets and also offers extensive RAM compatibility. You can easily pair it with both newer and older CPUs.

Main Features

Performance
Recommended Placement: Processor
Type: Air Cooling
Fan Diameter: 120/140 mm
Supported Processor Sockets: LGA 1200, LGA 1366, LGA 1700, LGA 2011, LGA 2011-v3, LGA 2066, LGA 775, Socket AM2+, Socket AM3+, Socket AM4, Socket AM5, Socket FM1, Socket FM2+
Fan Speed 2 (min.): 250 RPM
Fan Speed 2 (max.): 1400 RPM
Fan Speed (min): 250 RPM
Fan Speed (max): 1400 RPM
Mean Time Between Failures (MTBF): 100,000 h

Design
Product Color: Black
Number of Fans: 2 Fans
Number of Heat Pipes: 6

Performance
Thermal Design Power (TDP): 220 W

Weight and Dimensions
Heatsink Width: 15.9 cm
Heatsink Depth: 13.1 cm
Heatsink Height: 14.4 cm
Fan Dimensions (W x D x H): 140 x 25 x 140 mm
Dimensions Fan 2 (W x D x H): 120 x 25 x 120 mm

Included in Delivery
Mounting Kit: Yes
Installation Instructions: Yes.

Actual product image Endorfy Fortis 5 (159 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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