Avlano CPU PRO Wärmeleitpaste, 30g, bis 230 ℃

When it comes to heat dissipation between the CPU or GPU and the heatsink, choosing the right thermal paste is crucial. The CPU PRO thermal paste, with a content of 30 g, has been specifically developed for demanding systems where maximum reliability and efficient heat transfer are essential. Whether for a high-end gaming PC, workstation, or server, this paste ensures optimal temperatures and reliably protects your hardware from overheating.

With a thermal conductivity coefficient of over 1.93 W/mK, it enables outstanding heat dissipation. The high viscosity of 380 10 (1/10 mm) guarantees an even distribution without air inclusions, making it ideal for precise applications. The thermal impedance is below 0.225 Cin/W, ensuring maximum efficiency. Thanks to a high density of over 2.4 g/cm, the paste remains stable and reliable even during prolonged operation.

The operating temperature ranges from -20 °C to +230 °C, while the paste can withstand temperatures up to 280 °C for short periods, making it perfect for systems under continuous load or overclocking. With a filling quantity of 30 grams, this product is ideal for system builders, repair services, or anyone looking to optimize cooling solutions regularly – far more than just a single application.

Product advantages at a glance:

• High thermal conductivity > 1.93 W/mK
• Large filling quantity: 30 g for multiple applications
• Temperature resistant up to 280 °C (short-term)
• Viscosity: 380 10 (1/10 mm)
• Thermal impedance < 0.225 Cin/W
• Operating temperature: -20 °C to +230 °C
• Density: > 2.4 g/cm

Whether for gaming enthusiasts, professional system integrators, or hobbyist PC builders, the CPU PRO thermal paste 30 g provides a powerful, long-lasting solution for excellent cooling.