For better heat dissipation between processor and fan. Should be used with all processors and fans, unless the fans are equipped with heat conducting foil or other materials for special heat dissipation.
The paste contains silver particles which conduct the heat very well. The silver particle content is approx. 99.9%. 3.5 grams are sufficient for approx. 20 applications. min. 9.0 W/m°K
| Safety note | Declarations of chemicals can be found in the specifications. |
| Weight | 3.50 g |
| Documents | |
| Item number | 279952 |
| Manufacturer | |
| Category | |
| Manufacturer no. | AS5-3.5G |
| Release date | 2/15/2004 |
| Sales rank in Category Thermal grease | |
| External links |
| Thermal paste type | Heat sink compound |
| Thermal conductivity | 9 W/m K |
| Signal word | WARNING |
| Hazard pictogram | GHS09 Environmentally harmful |
| Hazard information | H315, H411 |
| Weight | 3.50 g |
| Length | 7 cm |
| Width | 2 cm |
| Height | 2 cm |
| Weight | 5 g |
Specifications may include unverified machine translations.