Name: Wraith Prism
Brand: AMD
SKU: 30695982
Price: 17.9 CHF
Availability: InStock
Rating: 4.7 (11 reviews)

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The AMD Wraith Prism is a powerful CPU cooler designed for the AM4 processor socket. With a diameter of 92 mm and a weight of 545 g, this cooler provides effective cooling for high-performance processors. It features four 6 mm diameter heat pipes that ensure efficient heat dissipation. The Wraith Prism is not only functional but also aesthetically pleasing, as it is equipped with RGB LEDs that allow for customizable lighting. The combination of an aluminum cooler core and a well-designed fan ensures optimal air circulation and reduced noise levels, making it an ideal choice for gaming and work PCs.

- RGB LED lighting for customization
- Efficient heat dissipation through four heat pipes
- Quiet operation thanks to a speed-controlled fan
- Sturdy construction with an aluminum cooler core.

Actual product image AMD Wraith Prism (95 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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