Velleman Lead-Free Solder Sn 99.3% Cu 0.7% 0.8mm 500G

The lead-free solder wire from Velleman is a high-quality solution for soldering tasks that combines precision with environmental awareness. With a tin content of 99.3% and 0.7% copper, this solder wire offers excellent electrical conductivity and ensures strong, reliable solder joints. The diameter of 0.8 mm is ideal for a variety of applications, from electronics to repairs. The solder wire features a resin core that facilitates soldering and enhances flow characteristics. With a melting point of 230 °C, this solder wire is suitable for most soldering applications and allows for precise handling. The 500 g spool provides a sufficient amount for numerous projects, making it a practical choice for hobbyists and professionals.

• High-quality alloy: 99.3% tin and 0.7% copper
• Resin core for improved flow characteristics
• Melting point of 230 °C for versatile applications
• Convenient 500 g spool for extensive projects.