Name: Mycro Direct-Die CPU Water Cooler - Socket AM5
Brand: Thermal Grizzly
SKU: 37273245
Price: 145 CHF
Availability: InStock
Rating: 5 (2 reviews)

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Thermal Grizzly

The AM5 Mycro Direct-Die is a water cooler designed for AMD Ryzen 7000 CPUs. The water cooler sits directly on the chiplets of the delidded Ryzen CPU, shortening the path to the water circuit. Additionally, the micro fins assist in the transport of waste heat.

Made from nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity, further enhanced by an optimized structure of micro fins on the top. With direct die cooling, there is no layer of thermal paste or the CPU heat spreader compared to standard water cooling. This significantly improves the heat transfer from the CPU to the water cooling circuit. The cover of the AM5 Mycro Direct-Die is made from CNC-milled polyoxymethylene (POM) and features one inlet and one outlet with G1/4-inch threads.

The nickel-plated surface of the AM5 Mycro Direct-Die is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler, preventing the liquid metal from diffusing into the copper and minimizing alloy formation. As a result, reapplying liquid metal is generally not necessary. For a maintenance-free system, a KryoSheet graphene thermal pad can be used as a thermal interface between the CPU and the AM5 Mycro Direct-Die. Since KryoSheet pads are electrically conductive, a cover to protect the electronic components on the CPU package is included.

Actual product image Thermal Grizzly Mycro Direct-Die CPU Water Cooler - Socket AM5

Key specifications

Connection

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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