Name: SNK-P0048PS (2011) 2U Passive
Brand: Supermicro
SKU: 5710655
Price: 60.6 CHF
Availability: InStock

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Supermicro

2U Passive CPU Heat Sink. CPU cooler for processor sockets LGA 2011 R3, LGA 2011 Narrow ILM. Cooling type: passive (without fan). Noise level during operation: 0 dBA. CPU TDP up to 145 watts. For Intel Xeon processors E5-2600 and E5-4600 series. Supermicro certified. This CPU cooler is designed for Supermicro X9 and X10 generations of 2U UP, DP, and MP servers with Intel Xeon E5-2600 or E5-4600 series processors. The cooler has been fully tested and validated by Supermicro to ensure the best quality and cooling performance. The Supermicro brand. Supermicro designs, develops, and manufactures optimized server solutions based on the x86 architecture. The company's extensive product range includes the industry's broadest selection of server, high-end workstation, and storage systems, as well as energy-efficient server components, known as Server Building Blocks Solutions, which include server boards, chassis, and power supplies. Additionally, Supermicro's powerful Universal I/O (UIO) expansion card technology and other system accessories are included. Special emphasis is always placed on energy efficiency to provide effective solutions optimized for a wide range of customer applications.

Actual product image Supermicro SNK-P0048PS (2011) 2U Passive (64 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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