Name: MCPU-X3
Brand: Mars Gaming
SKU: 66586890
Price: 15.5 CHF
Availability: InStock

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Mars Gaming

The MCPU-X3 from Mars Gaming is a powerful top blower CPU cooler specifically designed for compact systems such as SFF/Mini ITX and compact towers. With its flat design and a combination of an aluminum block, aluminum fins, and three highly conductive heat pipes, it ensures efficient heat dissipation. The integrated high-performance PWM fan with Fluid Dynamic Bearing (FDB) guarantees quiet cooling while maintaining stable temperatures even under heavy load. The easy installation and universal compatibility with Intel and AMD processors make it straightforward to set up in existing configurations. The MCPU-X3 is not only functional but also features appealing FRGB lighting that enhances the appearance of the PC. Its low profile fits into tight cases and improves airflow while creating space next to the RAM modules and power supply cover.

- Flat design for compact systems
- Three highly conductive heat pipes for efficient heat dissipation
- PWM fan with FDB bearings for quiet operation
- Easy installation and universal compatibility with Intel and AMD
- FRGB lighting for an attractive look.

Actual product image Mars Gaming MCPU-X3 (132 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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