Name: ThinkSystem Intel Xeon
Brand: Lenovo
SKU: 12279535
Price: 3984 CHF
Availability: OutOfStock

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Lenovo

The ThinkSystem Intel Xeon Gold 5218 processor from Lenovo is a powerful solution specifically designed for demanding data centers and multi-cloud environments. With a clock speed of 2.3 GHz and 16 cores supporting 32 threads, this processor delivers outstanding performance for complex network and storage workloads. The architecture of the processor is based on advanced 14nm technology, ensuring high efficiency and reliability. The Xeon Gold 5218 supports up to 1 TB of DDR4 RAM and utilizes a hexa-channel memory design to maximize data processing speed. Additionally, it features hardware-enhanced security functions and is optimized for scalability of up to four sockets, making it an ideal choice for modern server solutions.

- Maximum turbo frequency of 3.9 GHz for additional performance when needed
- Supports up to 1 TB of RAM with DDR4 SDRAM technology
- Hexa-channel memory architecture for improved data bandwidth
- Integrated AVX-512 technology for optimized calculations
- Compatible with ThinkSystem models SR530, SR570, and SR630.

Actual product image Lenovo ThinkSystem Intel Xeon (LGA 3647, 2.30 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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