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The Intel Xeon Silver 4114 processor is a powerful option for server applications designed for efficiency and scalability. With 10 cores and 20 threads, this processor provides a solid foundation for demanding tasks in data centers and enterprise environments. The architecture is based on an advanced 14nm lithography, ensuring improved energy efficiency and performance. The processor supports up to 768 GB of DDR4 RAM across six memory channels, allowing for high memory capacity and speed. With a base clock frequency of 2.2 GHz and a maximum turbo frequency of 3 GHz, the Xeon Silver 4114 is capable of delivering high performance even in intensive applications. These features make it an ideal choice for servers that require a reliable and scalable solution.

- 10 cores and 20 threads for high multitasking performance
- Maximum RAM of 768 GB for extensive applications
- Hexa-channel memory architecture for improved bandwidth
- Energy-efficient 14nm lithography for optimized performance.

Actual product image Lenovo DCG ThinkSystem SR530 Intel Xeon Silver 4114 10C 85W 2.2GHz Processor Option Kit (LGA 3647, 2.20 GHz, 10 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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Lenovo DCG ThinkSystem SR530 Intel Xeon Silver 4114 10C 85W 2.2GHz Processor Option Kit

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