Name: LC-CC-120-ARGB-PRO, 800-1800 rpm, 58 CFM, 4-pin PWM, RGB LED, DC
Brand: LC-Power
SKU: 13912802
Price: 29.5 CHF
Availability: InStock
Rating: 4.9 (16 reviews)

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LC-Power

Short info: LC Power LC-CC-120-ARGB-PRO - CPU cooler - for LGA775, LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, LGA2011-3, LGA1151, AM4, LGA2066 - Aluminum and Copper - 120 mm - Black

Product description: The LC Power LC-CC-120-ARGB-PRO is a CPU cooler in black. It is compatible with various sockets, including LGA775, LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, LGA2011-3, LGA1151, AM4, and LGA2066.

The cooler is made of aluminum and copper and features a fan diameter of 120 mm. The fan bearing is a dynamic fluid bearing with a speed range of 800 to 1800 RPM and an airflow of 58 CFM. The rated voltage is 12 V.

The product material is plastic, and the dimensions are 12.5 cm x 7.5 cm x 14.5 cm with a weight of 906 g.

Special features include 16.8 million colors.

Actual product image LC-Power LC-CC-120-ARGB-PRO, 800-1800 rpm, 58 CFM, 4-pin PWM, RGB LED, DC (145 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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