Name: Xeon W W5-2465X
Brand: Intel
SKU: 25065150
Price: 1740 CHF
Availability: InStock

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Intel

The Intel Xeon W5-2465X is a powerful processor specifically designed for workstations. With a base clock frequency of 3.1 GHz and a maximum turbo frequency of up to 4.7 GHz, this processor delivers impressive performance for demanding applications. It features 16 cores and 32 threads, enabling efficient multitasking. The processor is equipped with a 33.75 MB L3 cache, which further enhances data processing speed. The Xeon W5-2465X supports quad-channel DDR5 RAM with a maximum speed of 4800 MHz and can manage up to 2 TB of memory, making it ideal for memory-intensive applications. The processor uses the LGA 4677 socket and has a maximum thermal design power (TDP) of 200 watts. This combination of high core count, advanced architecture, and support for modern technologies makes the Xeon W5-2465X an excellent choice for professional users who rely on performance and reliability.

- 16 cores and 32 threads for parallel processing
- Maximum turbo frequency of 4.7 GHz
- Supports up to 2 TB of DDR5 RAM at 4800 MHz
- 33.75 MB L3 cache for improved data processing
- Compatible with LGA 4677 socket and W790 chipset.

Actual product image Intel Xeon W W5-2465X (LGA 4677, 3.10 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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