Name: Xeon 6238R FC-LGA647 Cache Boxed CPU
Brand: Intel
SKU: 14104452
Price: 2869 CHF
Availability: OutOfStock

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Intel

The Intel Xeon Gold 6238R is a powerful processor designed for demanding data centers and multi-cloud computing environments. With a base clock frequency of 2.2 GHz and the ability to reach up to 4 GHz in turbo mode, this processor delivers impressive performance for complex workloads. It features 28 cores and supports 56 threads, enabling efficient processing of multiple tasks simultaneously. The processor is equipped with 38.5 MB of L3 cache, further enhancing data processing speed. The Xeon Gold 6238R is designed for the LGA 3647 socket and supports DDR4 RAM with a maximum memory capacity of up to 1000 GB. With a maximum Thermal Design Power (TDP) of 165 watts, this processor is both powerful and energy-efficient, making it an ideal choice for modern data center environments.

- 28 cores and 56 threads for high parallel processing
- Maximum turbo clock frequency of 4 GHz
- Supports up to 1000 GB of DDR4 RAM
- Optimized for multi-cloud computing and network workloads
- Integrated Speed Select Technology (SST) for enhanced performance.

Actual product image Intel Xeon 6238R FC-LGA647 Cache Boxed CPU (LGA 3647, 2.20 GHz, 28 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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