Name: Pentium G4400
Brand: Intel
SKU: 5748045
Price: 39 CHF
Availability: InStock
Rating: 4.3 (27 reviews)

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Intel

Inactivity Status  
Idle states (C-states) are used to save energy when the processor is idle. C0 is the active state, meaning the CPU is performing meaningful tasks. C1 is the first idle state, C2 is the second, and so on, with higher numbered C-states implementing more energy-saving measures.  

Enhanced Intel SpeedStep® Technology  
The enhanced Intel SpeedStep® technology is an advanced feature designed for mobile devices that require a combination of high performance with the lowest possible energy consumption. The traditional Intel SpeedStep® technology adjusts voltage and frequency simultaneously between high and low values based on processor load. The enhanced Intel SpeedStep® technology builds on this architecture and employs design strategies such as separating voltage and frequency changes, as well as clock partitioning and recovery.  

Thermal Monitoring Technology  
The thermal monitoring technology protects the processor package and the system from temperature-related failures through temperature management functions. A digital on-die temperature sensor detects the core temperature, and the temperature management functions reduce the package's energy consumption and thus the temperature as needed to maintain the limits for normal operation.

Actual product image Intel Pentium G4400 (LGA 1151, 3.30 GHz, 2 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Condition	Used
Description	CPU only, without fan (image may vary slightly; I have several, but only took a photo once)
Purchased on	10.8.2017
Warranty	No warranty

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