Name: CPU/Xeon 5218R2.1Ghz FC-LGA3647
Brand: Intel
SKU: 15658098
Price: 1642.35 CHF
Availability: InStock

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Intel

The Intel Xeon Gold 5218R is a powerful processor designed for demanding server and workstation applications. With a clock speed of 2.1 GHz and the ability to handle up to 40 threads simultaneously, this processor delivers excellent performance for multitasking and compute-intensive tasks. The architecture is based on Cascade Lake technology and supports a maximum turbo frequency of up to 4 GHz, allowing for flexible adaptation to application requirements. The processor features 20 cores and a generous 27.5 MB L3 cache, enhancing efficiency in data processing. The Xeon Gold 5218R is compatible with the LGA3647 socket and supports up to 1 terabyte of DDR4 RAM, making it an ideal choice for modern data centers and enterprise applications.

- Intel® Trusted Execution Technology for enhanced security
- Intel® Directed I/O Virtualization Technology (VT-d) to improve I/O device virtualization
- Intel® Virtualization Technology (VT-x) for utilizing multiple virtual platforms
- Maximum TDP of 125 watts for efficient energy consumption
- Support for Hexa-Channel memory architecture for improved memory bandwidth.

Actual product image Intel CPU/Xeon 5218R2.1Ghz FC-LGA3647 (Socket P, 2.10 GHz, 20 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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