Name: Core i9-7960X
Brand: Intel
SKU: 6448553
Rating: 5 (4 reviews)

productDetailPageQuery

Intel

The Intel Core i9-7960X processor is a powerful 7th generation processor designed for demanding applications and multitasking. With up to 16 cores and 32 threads, this processor delivers outstanding performance, making it ideal for creative professionals and gamers. The base clock frequency of 2.8 GHz can be boosted to up to 4.2 GHz through Turbo Boost technology, enabling fast data processing and smooth application execution. The processor supports quad-channel memory and can manage up to 128 GB of RAM, making it an excellent choice for memory-intensive tasks. With a TDP of 165 watts and advanced 14nm lithography, the i9-7960X is both powerful and energy-efficient. Support for virtualization technologies and the ability to overclock provide additional flexibility for users looking to maximize their hardware's potential.

- Maximum performance with up to 16 cores and 32 threads
- Turbo Boost technology for clock speeds of up to 4.2 GHz
- Support for quad-channel memory with up to 128 GB of RAM
- Unlocked multiplier for easy overclocking
- Integrated virtualization technologies for enhanced performance.

Actual product image Intel Core i9-7960X (LGA 2066, 2.80 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Search

Settings

Customer account

Comparison lists

Watch lists

Cart

Intel Core i9-7960X

In Detail

Compare products

Goes with

Intel Core i9-7960X

Similar products with faster delivery

In Detail

Description

Specifications

Price trend

Warranty & return rates

Test reports1

Questions about this product2

Product ratings4

Compare products

Sales rank in Processors

Goes with

Accessories