Name: Core i9 12900
Brand: Intel
SKU: 18332879
Price: 443 CHF
Availability: InStock
Rating: 4.8 (6 reviews)

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Intel

This Intel Alder Lake processor supports performance-enhancing innovations such as PCI Express 5.0 and DDR5 memory. It provides an excellent foundation for high-performance components that benefit from higher bandwidth and faster data exchange, such as NVMe SSDs and graphics cards. Additionally, it offers outstanding connectivity: the processor supports Thunderbolt 4 and Intel Wi-Fi 6/6E, ensuring fast transfer speeds and connectivity to peripherals.

Actual product image Intel Core i9 12900 (LGA 1700, 2.40 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Core i9 12900

Processors

CPU coolers

Internal cables (PC)

CPU water coolers

30-day right of return

General information

Processor

AMD Technologies

Intel Technologies

Graphics processing unit

Memory

Origin

Product standards

Voluntary climate contribution

Scope of delivery

Package dimensions

The 16 processor cores and 24 threads deliver high processing performance for demanding applications.

High Processing Power

The processor requires a motherboard with the specific LGA 1700 socket for system integration.

LGA 1700 Socket

A maximum TDP of 65W leads to significant heat generation and requires correspondingly powerful cooling.

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Intel Core i9 12900

At a Glance

High Processing Power

LGA 1700 Socket

High Heat Generation

In Detail

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Intel Core i9 12900

At a Glance

High Processing Power

LGA 1700 Socket

High Heat Generation

In Detail

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Questions about this product4

Product ratings6

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LGA 1700 Socket