Name: Core i7 4770K BOX
Brand: Intel
SKU: 439609
Rating: 4.41 (29 reviews)

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Intel

Outstanding performance and brilliant display at the highest level. Get top performance for the most demanding applications with an Intel® Core™ i7 processor of the fourth generation. Whether it's 3D or HD entertainment, multitasking, or multimedia: the Intel® Core™ i7 processor of the fourth generation delivers peak performance for the most challenging tasks.

The Intel® Hyper-Threading technology enables intelligent multitasking, allowing you to switch effortlessly between applications. Intel® Turbo Boost Technology 2.0 automatically unleashes additional power when needed. The integrated graphics capabilities in the processor ensure smooth and perfectly tuned playback of your movies, games, and photos—without the need for additional hardware in your PC!

Treat yourself to strong Turbo Boost performance and longer battery life, and enjoy the peace of mind that comes with integrated security, knowing that you are better protected. Experience the visible difference. The Intel® Core™ i7 processor of the fourth generation is the optimal choice for anyone who demands the highest standards from their computer. Because more fascinating than our technology is what you can do with it.

Actual product image Intel Core i7 4770K BOX (LGA 1150, 3.50 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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