Name: Core i7-12700
Brand: Intel
SKU: 17761681
Price: 294.91 CHF
Availability: InStock
Rating: 5 (7 reviews)

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Intel

With its revolutionary hybrid design, the Intel Core processor of the 12th generation represents a breakthrough in x86 architecture. For the first time in a desktop processor, the hybrid architecture features two types of cores: Performance cores (P-cores) and Efficient cores (E-cores), delivering performance and/or efficiency when you need it. Additional features include PCIe 5.0 readiness, DDR5 support, and Intel 7 process technology for higher core density. The Intel Core i7-12700 has 8 P-cores, 4 E-cores, and a total of 20 threads, providing a new level of performance for gaming, creativity, and productivity.

Actual product image Intel Core i7-12700 (LGA 1700, 2.10 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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