Name: Core i7-11700K
Brand: Intel
SKU: 14715799
Price: 483 CHF
Availability: InStock
Rating: 4.81 (157 reviews)

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Intel

The Intel Turbo Boost technology dynamically increases a processor's frequency as needed by utilizing temperature and power reserves to provide more speed or greater energy efficiency. The Intel vPro technology is a collection of security and manageability features integrated into the processor that covers four critical areas of IT security: 1) Threat management, including protection against rootkits, viruses, and malware, 2) Protection of identities and website access points, 3) Protection of confidential personal and business data, 4) Remote and local monitoring, correction, and repair of PCs and workstations. The Intel Hyper-Threading technology allows for two processing threads per physical core. Multi-threaded applications can perform more tasks in parallel and complete tasks faster. With Intel Virtualization Technology (VT-x), a hardware platform can be used as multiple "virtual" platforms. It offers improved manageability through reduced downtime and maintains productivity by shifting computing operations into separate partitions. Intel Directed I/O Virtualization Technology (VT-d) continues the existing support for virtualization solutions for IA-32 (VT-x) and Itanium processor systems (VT-i) and expands it to include support for I/O device virtualization. Intel VT-d can help users enhance the security and reliability of systems as well as the performance of I/O devices in virtualized environments.

Actual product image Intel Core i7-11700K (LGA 1200, 3.60 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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