Name: Core i7-10700K-Avengers Edition
Brand: Intel
SKU: 13508770
Rating: 4.81 (63 reviews)

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Intel

The Intel Core i7-10700K processor is a powerful 10th generation CPU optimized for demanding applications and gaming. With a base clock speed of 3.8 GHz and the ability to reach up to 5.1 GHz in Turbo Boost mode, this processor delivers impressive performance for multitasking and compute-intensive tasks. It features 8 cores and 16 threads, allowing for efficient processing of multiple tasks simultaneously. The LGA 1200 socket ensures easy integration into modern motherboards, while the 16 MB L3 cache enhances data processing speed. Support for DDR4 RAM and the ability to utilize up to 128 GB of memory make it a flexible choice for various applications. Additionally, the processor offers integrated graphics capabilities with Intel UHD Graphics 630, providing appealing visual performance for everyday applications and multimedia content.

- Intel® Trusted Execution Technology for enhanced security
- Intel® Directed I/O Virtualization Technology (VT-d) to improve system performance in virtualized environments
- Intel® Virtualization Technology (VT-x) for utilizing multiple virtual platforms
- Maximum Turbo frequency of 5.1 GHz for additional performance when needed
- Support for Intel Optane technology to enhance storage performance.

Actual product image Intel Core i7-10700K-Avengers Edition (LGA 1200, 3.80 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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