Name: Core i5-9400F
Brand: Intel
SKU: 10510458
Price: 155 CHF
Availability: InStock
Rating: 4.8 (68 reviews)

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Intel

The Intel Core i5-9400F is part of the budget models of the Core 9000 series and features six cores. This mid-range CPU impresses with increased clock rates and optimized boost functions compared to its predecessors, and it has a TDP of only 65 watts. The processor is compatible with Socket 1151 motherboards of the 300 series. With a base clock of 2.9 GHz, the Core i5-9400F offers a high clock rate that automatically increases when more performance is needed. Depending on the application's or game's requirements, its Turbo Boost function raises the clock frequency to up to 4.1 GHz. The processor supports a maximum standard clock of 2666 MHz for DDR4 memory and supports dual-channel mode. Depending on the motherboard, RAM kits with significantly higher clock rates can also be used through overclocking. Intel's ninth-generation Core processors are manufactured using the 14nm++ process. According to Intel, this allows for up to 26% more performance with approximately 50% lower power consumption.

The F version comes without integrated graphics. The "F" designation means that the CPU is delivered with the integrated graphics unit disabled. Therefore, a dedicated graphics card is required to operate a system with this processor.

Actual product image Intel Core i5-9400F (LGA 1151, 2.90 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Condition	As good as new
Purchased on	14.2.2022
Warranty	No warranty

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