Name: Core i5-8600K
Brand: Intel
SKU: 6448577
Rating: 4.9 (52 reviews)

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Intel

The Intel Core i5-8600K is a powerful eighth-generation processor designed for demanding applications and gaming. With a base clock speed of 3.6 GHz and the ability to reach up to 4.3 GHz in Turbo mode, this processor offers impressive responsiveness and performance. It features six cores and supports six threads, allowing for efficient multitasking. The LGA1151 socket ensures easy integration into compatible motherboards. The processor supports DDR4 RAM and offers a maximum memory capacity of 64 GB, making it ideal for modern applications. Additionally, the i5-8600K is equipped with integrated Intel UHD Graphics 630, providing solid graphics performance for everyday applications and multimedia. With a Thermal Design Power (TDP) of 95 W, the processor is energy-efficient and suitable for both gaming and workstation setups.

- Maximum Turbo clock speed of 4.3 GHz for extra performance
- Supports dual-channel memory with up to 64 GB of DDR4 RAM
- Integrated Intel UHD Graphics 630 for basic graphics processing
- Unlocked multiplier for overclocking potential
- Supports modern instruction sets like AVX 2.0 and SSE4.2.

Actual product image Intel Core i5-8600K (LGA 1151, 3.60 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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