Name: Celeron G6900
Brand: Intel
SKU: 21531659
Price: 58.95 CHF
Availability: InStock

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Intel

The Intel Celeron G6900 is a powerful processor suitable for a variety of applications. With a clock speed of 3.4 GHz and two cores, it delivers solid performance for everyday tasks and multitasking. The processor features the LGA1700 socket architecture and supports the latest DDR5 RAM technology, enabling improved memory bandwidth and efficiency. The integrated UHD Graphics 710 provides appealing graphics performance, making it ideal for multimedia applications and light gaming. Additionally, the Celeron G6900 is equipped with advanced virtualization technologies that ensure enhanced performance and security in virtualized environments. With a maximum TDP of 46 watts, the processor is energy-efficient and well-suited for compact systems and energy-efficient builds.

- Intel® Directed I/O Virtualization Technology (VT-d) enhances security and performance in virtualized environments
- Intel® Virtualization Technology (VT-x) allows a hardware platform to be used as multiple virtual platforms
- Support for 64-bit processing with Intel® 64 architecture, which can address more than 4 GB of memory
- Maximum RAM capacity of 128 GB with dual-channel memory channels for improved performance
- Integrated graphics with UHD Graphics 710, providing an appealing visual display.

Actual product image Intel Celeron G6900 (LGA 1700, 3.70 GHz, 2 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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