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The A4-3300M processor from HP Inc. is a powerful processor designed for various applications in notebooks and desktop computers. With a clock speed of 1.9 GHz and two processor cores, it offers solid performance for everyday tasks as well as multimedia applications. The integrated Radeon HD 6480G graphics provide enhanced visual representation, making it a suitable choice for users who require both computing and graphics performance. The processor features a 64-bit architecture and supports DDR3 RAM, allowing for efficient use of memory. With a maximum Thermal Design Power (TDP) of 35 watts, the A4-3300M is energy-efficient and well-suited for mobile devices where power consumption is a key consideration. The 32-nanometer lithography helps reduce energy consumption and improve overall performance.

- Processor socket: Socket FS1
- Maximum TDP of 35 watts for energy efficiency
- Integrated Radeon HD 6480G graphics for enhanced visual performance
- 64-bit architecture for extended software compatibility
- 2 megabytes of L3 cache for faster data access.

Actual product image HP Processor A4-3300M (Socket FS1, 1.90 GHz, 2 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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