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Ernitec

The Ernitec CORE-5-1X-CPU-G6242R-V2 is a powerful processor specifically designed for server applications. With Intel® Xeon® Gold architecture, this processor offers high efficiency and scalability necessary for demanding computing tasks. The 14nm lithography ensures improved energy efficiency and performance. The processor supports up to 1 TB of DDR4 SDRAM and enables fast data processing through its hexa-channel memory architecture. With 20 cores and 40 threads, the G6242R is capable of handling multiple tasks simultaneously, making it ideal for virtualization and data-intensive applications. Support for various instruction sets, including AVX-512, allows for optimized performance in complex calculations. The Ernitec G6242R is therefore an excellent choice for companies seeking a reliable and powerful CPU for their server infrastructure.

- Maximum clock frequency of 4.1 GHz in Turbo mode
- Supports up to 1 TB of RAM with DDR4 SDRAM
- 20 cores and 40 threads for high multitasking performance
- Hexa-channel memory architecture for improved data bandwidth
- Maximum TDP of 205 watts for efficient energy consumption.

Actual product image Ernitec Upgrade 1x4210 CPU to 1x6242R (LGA 3647, 3.10 GHz, 20 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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