Name: AN400
Brand: Deepcool
SKU: 52272300
Price: 43.5 CHF
Availability: InStock

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Deepcool

AN400 BK

The AN400 BK is a flat air cooler with 4 heat pipes that offers a TDP of 150 W in a compact heatsink. With unobstructed space for RAM modules and a top-down airflow, the AN400 is an excellent choice for everything from small ITX builds to larger systems.

Compact and feature-rich

With 62 nickel-plated aluminum fins, 4 optimized heat pipes, and an enlarged copper cooling plate, the AN400 BK provides significant cooling potential in a CPU cooler that is only 53 mm tall.

Small but powerful

Equipped with a sleek 92 mm PWM-capable FDB fan featuring a visible 6-phase motor, the AN400 BK can spin up to an impressive 2950 RPM while remaining below 23.2 dB(A). A noise-reducing adapter cable is included.

Passive air circulation

The top-down design has the added benefit of providing passive air circulation to the surrounding VRMs around the CPU.

Simplified support

The fully metal backplate is easy to install and evenly distributes pressure from the back of the motherboard while providing additional stability behind the CPU socket.

Actual product image Deepcool AN400 (52.50 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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