Name: Ryzen 9 9950X3D
Brand: AMD
SKU: 54667968
Rating: 4.88 (42 reviews)

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The Ryzen 9 9950X3D from Advanced Micro Devices is a powerful desktop processor designed for demanding applications and gaming. With a base clock speed of 4300 MHz and an impressive turbo boost frequency of up to 5700 MHz, this processor delivers outstanding performance for multitasking and compute-intensive tasks. The Ryzen 9 9950X3D features 16 cores, enabling efficient processing of multiple tasks simultaneously. It is equipped with a generous 128 MB L3 cache, further enhancing data processing speed. The AM5 socket ensures easy integration into modern motherboards and allows for the use of the latest technologies. With a maximum TDP of 170 watts, the Ryzen 9 9950X3D is designed for high-performance systems that demand significant computing power.

- 16 processor cores for efficient multitasking
- Maximum turbo frequency of 5700 MHz
- 128 MB L3 cache for improved data processing
- AM5 socket for modern system compatibility
- Integrated Radeon GPU with a clock speed of 2200 MHz.

Actual product image AMD Ryzen 9 9950X3D (AM5, 4.30 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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