Name: Ryzen 9 7900X
Brand: AMD
SKU: 21918729
Price: 252 CHF
Availability: OutOfStock
Rating: 4.8 (117 reviews)

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The AMD Ryzen 9 7900X from the Raphael processor family features 12 CPU cores based on the "Zen 4" architecture. Following "Zen," "Zen+," "Zen 2," and "Zen 3," this is the fifth generation of the Zen microarchitecture. Each processor core has access to the entire L3 cache, which significantly contributes to the enhanced performance in gaming. Paired with an AMD X670(E) or B650(E) chipset, the AMD Ryzen 9 7900X supports the PCI-Express 5.0 standard, which is twice as fast compared to PCIe 4.0. All Ryzen 7000 processors utilize the AM5 platform and have been designed for use with compatible AMD chipsets.

Actual product image AMD Ryzen 9 7900X (AM5, 4.70 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Ryzen 9 7900X

Processors

CPU coolers

Internal cables (PC)

CPU water coolers

30-day right of return

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General information

Processor

Graphics processing unit

Memory

Origin

Product standards

Voluntary climate contribution

Scope of delivery

Package dimensions

The 12 processor cores and 24 threads, combined with 64 MB of L3 cache, deliver exceptional processing speeds for multi-threaded applications.

High Processing Performance

The model requires an AM5 socket motherboard and supports the current PCI Express 5 standard.

Modern System Compatibility

With a maximum TDP of 170 W, the processor generates a significant amount of heat for its performance class.

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AMD Ryzen 9 7900X

At a Glance

High Processing Performance

Modern System Compatibility

High Cooling Demand

Sales rank 34 of 716

In Detail

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AMD Ryzen 9 7900X

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At a Glance

High Processing Performance

Modern System Compatibility

High Cooling Demand

Sales rank 34 of 716

In Detail

Description

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Product ratings117

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