Name: Ryzen 9 7900 MPK 12 units
Brand: AMD
SKU: 32465872
Price: 469 CHF
Availability: InStock

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The AMD Ryzen 9 7900 processor is a powerful CPU designed for demanding applications and multitasking scenarios. With a base clock speed of 3.7 GHz and the ability to handle up to 24 threads simultaneously, this processor delivers outstanding performance for gaming, content creation, and professional applications. The Ryzen 9 7900 is equipped with 12 cores that enable efficient task processing, while the generous 64 MB L3 cache optimizes data processing speed. The processor is designed for the AM5 socket and supports modern technologies that provide improved energy efficiency and performance. This multipack option is ideal for businesses or enthusiasts who need multiple units to upgrade their systems or create new builds.

- 12 cores and 24 threads for high multitasking performance
- Maximum turbo clock speed of 3.7 GHz for enhanced performance
- 64 MB L3 cache for faster data access
- Compatible with the modern AM5 socket for future upgrades.

Actual product image AMD Ryzen 9 7900 MPK 12 units (AM5, 3.70 GHz, 12 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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