Name: Ryzen 9 3950X
Brand: AMD
SKU: 11239808
Price: 769 CHF
Availability: InStock
Rating: 4.9 (118 reviews)

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AMD Ryzen 3000 series processors deliver unmatched technology for outstanding performance. Experience and utilize technologies such as Precision Boost Overdrive, Precision Boost 2, Pure Power, and AMD StoreMI, all with the AMD Ryzen 3000 series processors. AMD Ryzen 3rd generation processors with 7nm "Zen 2" cores set standards for high performance through exclusive manufacturing technology, groundbreaking chip throughput, and revolutionary overall performance. The successful series of technological advancement: AMD Ryzen 3rd generation processors. For the first time, it also offers connectivity for PCIe 4.0 to support the most advanced motherboards, graphics cards, and storage technologies in the world. AMD Ryzen 3rd generation processors deliver what you need, anytime and anywhere. The world's most advanced desktop processor is not just made for performance, but for winners. Official information from AMD: September delivery not guaranteed.

Actual product image AMD Ryzen 9 3950X (AM4, 3.50 GHz, 16 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Condition	As good as new
Purchased on	20.7.2021
Warranty	No warranty

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