Name: Ryzen 7 Pro 7745 - 3.8 GHz - 8 cores
Brand: AMD
SKU: 37062798
Price: 343.83 CHF
Availability: InStock

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The AMD Ryzen 7 Pro 7745 is a powerful processor designed for demanding applications and multitasking scenarios. With a base clock speed of 3.8 GHz and the ability to reach up to 5.3 GHz in Turbo mode, this processor delivers impressive performance for a variety of applications, from office software to graphics-intensive programs. The architecture is based on a 5-nanometer process, enabling high energy efficiency and improved performance. With 8 cores and 16 threads, the Ryzen 7 Pro 7745 can handle multiple tasks simultaneously, making it ideal for professional users who rely on high computing power. The processor supports the AM5 socket and offers a range of modern interfaces, including PCI Express 5.0, to integrate the latest technologies. Additionally, it features a generous 32 MB cache that further optimizes data processing speed.

- 8 cores and 16 threads for efficient multitasking
- Maximum Turbo clock speed of 5.3 GHz
- 32 MB L3 cache for enhanced data processing
- Support for PCI Express 5.0 for high bandwidth
- Energy-efficient 5-nanometer lithography.

Actual product image AMD Ryzen 7 Pro 7745 - 3.8 GHz - 8 cores (AM5, 3.80 GHz, 8 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

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Germany

JACOB

Ryzen 7 Pro 7745 - 3.8 GHz - 8 cores

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