Name: Ryzen 5 3400G
Brand: AMD
SKU: 11239818
Price: 161 CHF
Availability: InStock
Rating: 4.6 (66 reviews)

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The APUs of the Ryzen 3000 series are based on the Zen+ architecture and are equipped with a particularly powerful graphics unit. The processor concept was originally developed for use in netbooks, but it is also excellent for low-budget gaming systems and compact multimedia PCs. What is particularly notable about the AMD Picasso series APUs is the integrated graphics, which is based on the Vega architecture. The fusion of the processor and Vega graphics chip results in a very efficient and powerful APU. The AMD Ryzen 5 3400G is equipped with the Vega 11 GPU. In this configuration, the graphics chip has 11 compute units with a total of 704 shaders available. The GPU base clock is 1400 MHz.

Actual product image AMD Ryzen 5 3400G (AM4, 3.70 GHz, 4 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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