Name: Ryzen 3 2200G
Brand: AMD
SKU: 7326990
Price: 99.9 CHF
Availability: InStock
Rating: 4.5 (55 reviews)

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The AMD Ryzen 3 2200G is a processor from the Raven Ridge generation featuring four physical CPU cores. This quad-core processor operates at a clock speed of 3.5 GHz per core, which can be precisely adjusted in real-time to match the current workload scenario using Precision Boost, allowing it to increase up to 3.7 GHz Turbo in 25 MHz increments within the TDP limits.

The silicon is manufactured using an advanced 14-plus nm FinFET process with stacked transistors. The significantly reduced structure sizes provide extra space on the processor die, enabling the integration of a total of 2 MB of Level 2 cache and 4 MB of Level 3 cache, as well as the powerful Vega 8 GPU with 512 shaders across 8 compute units.

The AMD Ryzen 3 2200G is equipped with the Auto-OC feature Extended Frequency Range (XFR), which allows the processor clock to exceed the factory-set maximum boost clock limit, provided that the cooling solution has sufficient headroom. Once the integrated sensors of the CPU detect additional cooling capacity, the Ryzen CPU automatically adjusts its clock rates to match the cooling solution. For manual overclocking, the AMD Ryzen APU features an unlocked multiplier.

Actual product image AMD Ryzen 3 2200G (AM4, 3.50 GHz, 4 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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