Name: Contac 9 SE
Brand: Thermaltake
SKU: 37750428
Price: 15.7 CHF
Availability: InStock
Rating: 5 (1 reviews)

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Thermaltake

The heatsink is made of 0.4 mm thick aluminium with 2.5 mm air gaps and 2 solid copper heatpipes with a diameter of 6 mm, which run through the fins and ensure maximum thermal conductivity. The heatpipes are in direct contact with the CPU to ensure fast and efficient heat dissipation and improve overall thermal performance. 

The Contac 9 SE is equipped with a 92 mm PWM-controlled fan that reaches a maximum speed of up to 2000 rpm, generating an airflow of 33.12 CRM and a static pressure of 1.02 mm H2O, while maintaining a noise level of 24.5 dB-A thanks to its hydraulic bearing. The design of this fan ensures optimum cooling performance and improves the service life of the device.

The Contac 9 SE comes with specially designed fan brackets that allow the fan to be placed firmly and evenly on the heatsink, making installation and removal much easier. The Contac 9 SE was developed with a non-interference concept that allows the user to install high-performance RAM without the CPU cooler getting in the way.

Actual product image Thermaltake Contac 9 SE (150 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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