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Thermalright Helios AMD Thermal pad

0.20 mm, 8.50 W/m K
Save CHF1.20
Delivered between Sat, 16.5. and Sat, 23.5.
More than 10 pieces in stock at supplier
Free shipping starting at 50.–

Product details

The Thermalright Helios AMD thermal pad is a high-performance thermal interface material specifically designed for efficient heat transfer in AMD processors. With a thermal conductivity of 8.5 W/m·K, it ensures effective cooling and contributes to the stability and longevity of the hardware. The pad has a thickness of just 0.2 mm, making it ideal for applications where space is limited. It is available in a convenient size of 40 mm x 40 mm, allowing for easy handling and adaptation to various components. This thermal pad is an excellent choice for anyone looking to optimize the performance of their AMD processors.

  • High thermal conductivity of 8.5 W/m·K for optimal cooling
  • Thin design with only 0.2 mm thickness for space-saving applications
  • Ideal for use with AMD processors to enhance heat dissipation.

Key specifications

Length
40 mm
Width
40 mm
Thickness
0.20 mm

General information

Item number
46982326
Manufacturer
Thermalright
Category
Thermal pads
Manufacturer No.
814256016230
Release date
2.7.2024

Colour

Colour
Grey

Thermal grease properties

Thermal paste type
Heat conducting pad
Thermal conductivity
8.50 W/m K

Scope of delivery

Items per sales unit
1x

Voluntary climate contribution

CO₂ emissions
2.25 kg
Climate contribution
CHF 0.11

Product dimensions

Length
40 mm
Width
40 mm
Thickness
0.20 mm

Package dimensions

Length
10.50 cm
Width
10.30 cm
Height
1.10 cm
Weight
34 g

30-day right of return
24 Months Warranty (Bring-in)

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