Team Group Dark Pro 8Pack Edition

The new high-end memory kits of the Dark Pro series in the "8Pack Edition" have been developed and specified by overclocking icon Ian "8Pack" Parry and renowned graphics card expert Andrew "Gibbo" Gibson.

Only Samsung B-Dies are used as ICs, which have been thoroughly tested by the 8Pack team for compatibility and overclocking potential with the latest Intel Kaby Lake (Z170/Z270) and AMD Ryzen platforms (B350/X370). With aggressive out-of-the-box latencies of CAS 16-16-16-36 and high overclocking potential, this memory kit is ideally suited for enthusiast gaming and overclocking. Achievable frequencies extend beyond 4,500 MHz in dual-channel mode on X299 platforms and up to 3,600 MHz on Ryzen systems, with moderate latencies. The Dark Pro "8Pack Edition" RAM kits are also very flexible regarding latency tuning, allowing for a timing of CAS10 with a reduced memory clock.

The modules are equipped with massive heat spreaders made of black anodized aluminum in a sandwich construction, which, with their titanium-colored core and cutouts, create a simple yet very elegant visual accent. The total height of the modules is approximately 45.6 mm, which should be considered when choosing a CPU cooler. However, the heat dissipation from the RAM chips to the surrounding air in the Dark Pro Series is particularly high, providing ample cooling reserves during overclocking. Additionally, the PCB cover of the heat spreader can be removed, reducing the height to 37 millimeters and significantly improving compatibility with larger CPU coolers.