RS PRO Heat conducting material, 2.2W/m-K Self-adhesive, thickness 0.5mm, 150 x 150mm

The thermal interface material from Rs Pro is a self-adhesive thermal pad specifically designed for applications requiring efficient heat transfer. With a thermal conductivity of 2.2 W/m·K and a thickness of 0.5 mm, this pad offers excellent performance in conducting heat between components and preventing overheating. It is available in a convenient square format of 150 x 150 mm, making it ideal for use in various electronic devices and applications. The material is rated for operating temperatures from -40 °C to 200 °C, which enhances its versatility. Additionally, the high dielectric strength of up to 6 kV/mm ensures reliable performance under demanding conditions. The UL 94 V0 flammability rating provides extra safety during operation.

• Operating temperature from -40 °C to 200 °C
• Dielectric strength of up to 6 kV/mm
• Thermal resistance of 280 mW/°C
• High-quality silicone coating for improved adhesion
• Hardness of 10 Shore A for optimal flexibility.