Phanteks PH-NDC-02 Thermal compound

With the PH-NDC, PHANTEKS has developed a thermal paste made from silicone-free, diamond-like nanoparticles, suitable for use in low thermal resistance environments. In its compressed state, the nanoparticles are designed to help dissipate heat and transfer it optimally to the CPU cooler.

The PH-NDC is particularly easy to apply and can be removed if necessary. A pea-sized amount is sufficient to cover the entire surface of the CPU. The thermal paste unleashes its full potential immediately after application and efficiently conducts heat.

It is also a very handy thermal paste that, due to its low viscosity, can be spread very easily and extremely thinly—yet still provides good coverage—on a heat spreader.

Despite this, it offers good values in terms of thermal conductivity (4.5 W/m-°C) and thermal resistance (0.14 °C-in²/W). Additionally, the PH-NDC is non-electrically conductive, non-corrosive, contains no metal, and is virtually non-drying.

Caution! Please pay attention to the manufacturer's warnings before use!

Technical details:

• Quantity: 2x 2 g
• Density: 2.55 g/cm³
• Thermal resistance: 0.14 °C-in²/W
• Thermal conductivity: 4.5 W/m-°C
• Operating temperature: -40 °C - 150 °C.